[Optical Wafer Thickness MicroGauge]
FIBERPRO released Optical Wafer Thickness MicroGauge(IFP-801) which is of great
use in measurement of Thickness, TTV, Warp and Bow of various glass, transparent,
light-reflected materials. It can be designed under In-line/Off-line measurement condition with motion stage controller in various applications. There's no physical damage on the samples during measurement, and it can be protected from dust or pollutant by having a cover.
1. Features
- Non-contact
- High accuracy and repeatability
- Ultra-fast measurement speed
- No Calibration needed
- Full surface scanning
[IFP-801: For 8~12 inch Wafer]
2. Main Application
-Wafer/Glass/Quartz/SiO2/GaAS
- Etch/Grinder Process Control
- Metrology Industries
- Wafer Thinning Process
- Stress/TTV/Thickness/Warp/Bow Measurement & Analysis
3. Specification [IFP-801S: For 2~6 inch Wafer ]
- Accuracy:0.1um
- Measurement Range: 50um~2,000um
- Remote Interface: LAN
- Dimension(WxDxH)
: 550x620x291 mm /380x380x370mm
-Weight: 70kg/24kg
[Thickness measurement data of IFP-801]
4. Homepage: (http://www.fiberpro.com/)
5. Contact Point
Mr. Lee, Jong-Bo (042-360-0036~7, jblee@fiberpro.com, mjlee@fiberpro.com)
IFP-801,IFP-801S
